两种机器概念对非球面透镜制造过程的差异及影响

R. Hild, Sebastian Stahringer, R. Mandler, M. Degünther
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引用次数: 0

摘要

在半导体危机的背景下,中大型镜片(200 - 500毫米)的生产变得越来越重要。通过整个价值链,镜片的价值会大幅增加。为了达到最终的轮廓和质量,需要进行大量的工序。研磨和抛光过程必须精确协调,以达到所有要求。抛光过程并不总是一个可控变量,因为各种化学和机械影响共同影响过程结果。因此,控制磨削过程是很重要的。如何在不允许任何几何偏差的情况下尽可能提高表面质量的问题是中心问题。不同的机器概念及其优势在特定质量要求背景下的影响仍然是未知的。因此,将更详细地分析两种机器概念的比较及其对磨削过程、部件质量和抛光生成表面的可能性的影响。重点是OptoTech Optikmaschinen GmbH的MCG500和UPG500机器概念。结果表明,五轴磨床MCG500可以实现高质量的磨削工艺,其PV值在1.5 ~ 3 μm之间。与4轴机床UPG500相比,MCG500作为预磨机,在UPG500的帮助下实现了0.4 ~ 1.5 μm的PV。此外,与MCG500的10 ~ 20 μm相比,UPG500的亚表面损伤仅为3 ~ 7 μm。在达到UPG500的公差后,后续的抛光过程缩短了大约。与上游30%的磨削工艺相比,MCG500同时使工艺可靠性达到最终规格的提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Differences and effects of two machine concepts on the manufacturing process of aspherical lenses
The production of medium to large lenses (200 - 500 mm) is becoming increasingly important against the background of the semiconductor crisis. The value of a lens increases enormously through the entire value chain. A large number of processes are necessary to achieve the final contour and quality. The grinding and polishing processes must be precisely coordinated in order to achieve all requirements. The polishing process is not always a controllable variable, since various chemical and mechanical influences come together and affect the process result. For this reason, it is important to control the grinding process. The question of how it is possible to improve the surface quality as much as possible without allowing any geometric deviations is central. The effect of different machine concepts and their advantages against the background of specific quality requirements is still unknown. Therefore, a comparison of two machine concepts and their effects on the grinding process, the component quality and the possibilities of polishing the generated surfaces will be analyzed in more detail. The focus is on the MCG500 and UPG500 machine concepts from OptoTech Optikmaschinen GmbH. The results show, that the 5-axis grinding machine MCG500 enables a high-quality grinding process, which allows to reach a PV inbetween 1.5 - 3 μm. Compared to the 4-axis machine UPG500, the MCG500 is used as a pre-grinding machine to achieve a PV of 0.4 - 1.5 μm with the help of the UPG500. In addition the, the sub surface damage is only 3 - 7 μm on the UPG500 compared to 10 - 20 μm on the MCG500. With the achieved tolerances of the UPG500, the subsequent polishing process is shortened by approx. 30% compared to the upstream grinding process by the MCG500 and at the same time the process reliability to achieve the final specifications increases.
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