半导体制造多集群工具的稳态吞吐量和调度分析:一种分解方法

J. Yi, Shengwei Ding, Dezhen Song
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引用次数: 43

摘要

集群工具被广泛用作半导体制造设备。虽然单集群工具的吞吐量分析和调度已经得到了很好的研究,但对多集群工具的相应研究还处于初级阶段。本文分析了多集群工具的稳态吞吐量和调度问题。利用分解方法将多簇刀具问题分解为多个单簇刀具问题。然后将现有的吞吐量和调度研究结果应用于每个单集群工具。针对M集群工具,给出了一种O(M)吞吐量计算和机器人调度算法。以化学机械刨平(CMP)抛光机为例,说明了所提出的分解方法和算法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Steady-State Throughput and Scheduling Analysis of Multi-Cluster Tools for Semiconductor Manufacturing: A Decomposition Approach
Cluster tools are widely used as semiconductor manufacturing equipment. While throughput analysis and scheduling of single-cluster tools have been well-studied, the corresponding research on multi-cluster tools is still at the early stage. This paper analyzes steady-state throughput and scheduling of multi-cluster tools. A decomposition method is utilized to reduce a multi-cluster tool problem to multiple single-cluster tool problems. Existing research on the throughput and scheduling results is then applied to each single-cluster tool. For an M-cluster tool, an O(M) throughput calculation and robot scheduling algorithm is presented. A chemical-mechanical planarization (CMP) polisher is used as an example of the multi-cluster cluster tools to illustrate the proposed decomposition method and algorithms.
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