CMOS逻辑门栅氧化短路的建模与测试

Hong Hao, E. McCluskey
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引用次数: 27

摘要

采用实际缺陷模型,分析了CMOS简单逻辑门在栅极氧化短路情况下的电气和逻辑工作。这些模型反映了栅极氧化物短路的电阻性质以及n沟道和p沟道晶体管之间的差异。短路的电阻在决定实际电路行为方面起着中心作用。由栅极氧化物短路引起的故障不仅取决于包含故障的栅极的输入,还取决于电路中的其他信号,并且可以逃避使用正常TPG方案产生的测试。逻辑门的卡滞测试集不能保证检测逻辑门中所有晶体管栅源短路和栅漏短路。与p沟道晶体管相比,n沟道晶体管的栅极氧化物短路对电路工作的影响更大。揭示了现有晶体管级故障建模技术的一些局限性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the modeling and testing of gate oxide shorts in CMOS logic gates
The electrical and logic operation of CMOS simple logic gates in the presence of gate oxide shorts is analyzed using realistic defect models. These models reflect the resistive nature of gate oxide shorts and the difference between n- and p-channel transistors. The resistance of a short plays a central role in determining the actual circuit behavior. Faults caused by gate oxide shorts can be dependent not only on inputs to the gate containing the fault but also on other signals in the circuit, and can escape tests generated using normal TPG schemes. The stuck-at test set for a logic gate cannot guarantee to detect all transistor gate-to-source and gate-to-drain shorts in the logic gate. Gate oxide shorts in n-channel transistors affect circuit operation more severely than those in p-channel transistors do. Some limitations of present transistor-level fault modeling techniques are revealed.<>
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