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光通信系统的光子封装。基础和应用

Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005. Pub Date : 2005-07-07 DOI:10.1109/STYSW.2005.1617791
Ulrich Fischer-Hirchert
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引用次数: 0

摘要

在本报告中，提出了不同的光纤芯片耦合概念。讨论了自动化耦合过程，以及激光焊接、胶合和机械固定的不同模块。报告了热应力试验
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Photonic packaging for optical communications systems-basics and applications
In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported
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来源期刊
Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.
Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.
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