一种现成嵌入式处理器的在线磨损状态监测方法

Srinath Arunachalam, Thidapat Chantem, R. Dick, X. Hu
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引用次数: 5

摘要

晶体管的持续缩放导致芯片上功率密度呈指数级增长,从而导致温度升高。反过来,温度的升高直接导致处理器磨损率的增加。负偏置温度不稳定性(NBTI)是最主要的集成电路(IC)失效机制之一[13,5],它强烈依赖于温度。NBTI表现为增加电路延迟的形式,这可能导致时序故障和处理器崩溃。在设计实时嵌入式系统时,由于NBTI而监控处理器磨损进程的能力是有价值的。虽然可以使用磨损状态传感器检测NBTI,但并非所有芯片都配备了这些传感器,因为检测NBTI引起的磨损需要修改芯片设计,并且会产生面积和功率开销。NBTI传感器数据也可能不会在软件中暴露给用户。此外,由于磨损传感器设备与其他功能设备及其工作条件的差异,磨损传感器无法考虑磨损的变化。在本文中,我们提出了一种轻量级的在线方法来监测由于NBTI的现成嵌入式处理器的磨损过程。我们提出的方法既不需要阈值电压和关键路径的数据,也不需要额外的硬件。我们的方法也可以扩展到预测由于一些其他主要的集成电路失效机制而导致的磨损进程。对嵌入式处理器的实验提供了NBTI磨损随时间变化的见解。这些知识可以用于设计实时嵌入式系统,明确考虑运行时磨损的进展,以提高可预测性并保持寿命可靠性要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An online wear state monitoring methodology for off-the-shelf embedded processors
The continued scaling of transistors has led to an exponential increase in on-chip power density, which has resulted in increasing temperature. In turn, the increase in temperature directly leads to the increase in the rate of wear of a processor. Negative-bias temperature instability (NBTI) is one of the most dominant integrated circuit (IC) failure mechanisms [13, 5] that strongly depends on temperature. NBTI manifests in the form of increased circuit delays which can lead to timing failures and processor crashes. The ability to monitor the wear progression of a processor due to NBTI is valuable when designing real-time embedded systems. While NBTI can be detected using wear state sensors, not all chips are equipped with these sensors because detecting wear due to NBTI requires modifications to the chip design and incurs area and power overhead. NBTI sensor data may also not be exposed to users in software. In addition, wear sensors cannot take into account variations in wear due to the differences in the wear sensor devices and the other functional devices and their operating conditions. In this paper, we propose a lightweight, online methodology to monitor the wear process due to NBTI for off-the-shelf embedded processors. Our proposed method requires neither data on the threshold voltage and critical paths nor additional hardware. Our methodology can also be extended to predict the wear progression due to some other dominant IC failure mechanisms. Experiments on embedded processors provide insights on NBTI wear progression over time. This knowledge can be used to design real-time embedded systems that explicitly consider runtime wear progression to increase predictability and maintain lifetime reliability requirements.
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