Parallel-Plane Breakdown Fields of 2.8-3.5 MV/cm in GaN-on-GaN p-n Junction Diodes with Double-Side-Depleted Shallow Bevel Termination

We report homoepitaxial GaN p-n junction diodes with novel beveled-mesa structures. The n-layers and p-layers, the doping concentrations of which are comparable, were prepared. We found that electric field crowding does not occur in the structure using TCAD simulation. The fabricated devices showed the breakdown voltages of 180–480 V, small leakage currents, and excellent avalanche capabilities. The breakdown voltages increased at elevated temperature. At the breakdown, nearly uniform luminescence in the entire p-n junctions was observed in all the devices. These results are strong evidences that the uniform avalanche breakdowns occurred in the devices. We carefully characterized the depletion layer width at the breakdown, and the parallel-plane breakdown electric fields of 2.8-3.5 MV/cm were obtained, which are among the best of the reported non-punch-through GaN vertical devices.