等温电迁移试验中Cu-damascene结构的电阻不稳定性

2005 IEEE International Integrated Reliability Workshop Pub Date : 2005-10-17 DOI:10.1109/IRWS.2005.1609584

M. Impronta, S. Farris, A. Ficola, A. Scorzoni

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引用次数: 1

摘要

当采用正确的温度测定时，等温测试是一种很有前途的晶圆级工具，可以表征铜-大马士革金属化中的电迁移。本文提出了一种改进的反馈算法，以减少铜结构在应力阶段接近破坏时所观察到的电阻失稳

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Resistance instability in Cu-damascene structures during the isothermal electromigration test

The isothermal test is a promising wafer-level tool to characterize electromigration also in Cu-damascene metallizations, when a correct temperature determination is employed. In this work an improved feedback algorithm is proposed to reduce the observed resistance instability in the stress phase, when the copper structures are approaching the failure

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2005 IEEE International Integrated Reliability Workshop

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