Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Y. Qi, J. Fan
{"title":"用去嵌入法精确测量o型弹簧触点高频阻抗","authors":"Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Y. Qi, J. Fan","doi":"10.1109/ISEMC.2014.6899041","DOIUrl":null,"url":null,"abstract":"In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.","PeriodicalId":279929,"journal":{"name":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":"{\"title\":\"De-embedding method to accurately measure high-frequency impedance of an O-shape spring contact\",\"authors\":\"Qiaolei Huang, Jing Li, Joe Zhou, Wilson Wu, Y. Qi, J. Fan\",\"doi\":\"10.1109/ISEMC.2014.6899041\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.\",\"PeriodicalId\":279929,\"journal\":{\"name\":\"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"17\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2014.6899041\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2014.6899041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
De-embedding method to accurately measure high-frequency impedance of an O-shape spring contact
In this paper, a de-embedding method is proposed to measure the impedance of an innovative O-shape spring contact, for frequency up to 30 GHz. To allow the de-embedding method to be applied in practical situations, both conductor loss and the discontinuity associated with the junction are taken into account. Results obtained from the de-embedding method are validated using full wave simulation. In the simulation model, the O-shape spring contact is cut into two pieces based on the current flow paths, providing a straightforward way to understand why a resonance exists in the impedance profile of the connector. Lastly, the advantages and drawbacks of this method are discussed.