基于SOI的CWDM发射机板

3rd IEEE International Conference on Group IV Photonics, 2006. Pub Date : 2006-10-09 DOI:10.1109/GROUP4.2006.1708163

J. Bruns, T. Mitze, M. Schnarrenberger, L. Zimmermann, M. Krieg, J. Kreiss, K. Janiak, T. Hartwich, K. Petermann

{"title":"基于SOI的CWDM发射机板","authors":"J. Bruns, T. Mitze, M. Schnarrenberger, L. Zimmermann, M. Krieg, J. Kreiss, K. Janiak, T. Hartwich, K. Petermann","doi":"10.1109/GROUP4.2006.1708163","DOIUrl":null,"url":null,"abstract":"A CWDM transmitter board based on SOI is demonstrated. Active III/V components are integrated using Au/Sn solder technology and passive alignment. Precise mounting of lasers on the board is necessary to ensure low coupling losses","PeriodicalId":342599,"journal":{"name":"3rd IEEE International Conference on Group IV Photonics, 2006.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"CWDM Transmitter Board based on SOI\",\"authors\":\"J. Bruns, T. Mitze, M. Schnarrenberger, L. Zimmermann, M. Krieg, J. Kreiss, K. Janiak, T. Hartwich, K. Petermann\",\"doi\":\"10.1109/GROUP4.2006.1708163\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A CWDM transmitter board based on SOI is demonstrated. Active III/V components are integrated using Au/Sn solder technology and passive alignment. Precise mounting of lasers on the board is necessary to ensure low coupling losses\",\"PeriodicalId\":342599,\"journal\":{\"name\":\"3rd IEEE International Conference on Group IV Photonics, 2006.\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"3rd IEEE International Conference on Group IV Photonics, 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GROUP4.2006.1708163\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"3rd IEEE International Conference on Group IV Photonics, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2006.1708163","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

介绍了一种基于SOI的CWDM发射机板。有源III/V组件采用Au/Sn焊接技术和无源对准集成。为了确保低耦合损耗，必须在电路板上精确安装激光器

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

CWDM Transmitter Board based on SOI

A CWDM transmitter board based on SOI is demonstrated. Active III/V components are integrated using Au/Sn solder technology and passive alignment. Precise mounting of lasers on the board is necessary to ensure low coupling losses

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

3rd IEEE International Conference on Group IV Photonics, 2006.

自引率

0.00%

发文量