x射线投影光刻系统的吞吐量估计

Masaaki Itou, T. Terasawa, S. Moriyama
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摘要

最近一项关于x射线投影光刻(XRPL)的可行性研究已经证明了极高的分辨率,达到0.1µm1。然而,对于集成电路的实际制造,高吞吐量也是必要的。虽然XRPL系统的吞吐量已经估计在4.5nm2波长,但由于实际多层的低性能,该系统难以构建。我们讨论了使用13nm辐射的XRPL系统的吞吐量,可以制造出高质量的多层材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Throughput estimate of an X-ray projection lithography system
A recent feasibility study on X-ray projection lithography (XRPL) has demonstrated an extremely high resolution reaching 0.1 µ m1). For practical manufacturing of integrated circuits, however, a high throughput is also necessary. Although the throughput of an XRPL system was already estimated at a wavelength of 4.5nm2), this system is difficult to build owing to low performance of actual multilayers. We discuss the throughput of an XRPL system using 13nm radiation for which good quality multilayers can be fabricated3).
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