微孔表面改善微波元件多因素放电性能

W. Cui, Rui Wang, T. Hu, Jing Yang, Yong-ning He
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引用次数: 2

摘要

本文介绍了一种改善微波元件多因素放电性能的方法。它是用光刻技术或化学蚀刻法对镀银镀层进行具有规则微孔结构或不规则微孔结构的表面处理。比较了微孔结构对二次发射的影响。通过三维仿真和实验结果表明,c波段阻抗互感器可以有效地控制多因素放电电平。理论和实验结果表明,该方法能极大地提高微波元件的多因素放电性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improvement multipactor discharge of microwave components by micro-porous surface
A method for the improvement multipactor discharge of microwave components is described in this paper. It is a kind of surface treatments with regular micor-porous structure by the photolithography technique or irregular micro-porous structure by chemical etching process on silver plated coatings. Their influences of the micro-porous structure for secondary emission are compared. A C-band impedance transformer is used to valid multipactor discharge level by three-dimensional simulations and experimental results. Results show that this method can improve greatly the multipactor discharge of microwave components in theory and experiments.
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