压力约束模式下键合参数对热超声倒装芯片键合的影响

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Pub Date : 2006-06-27 DOI:10.1109/HDP.2006.1707571

Fuliang Wang, Junhui Li, Lei Han, J. Zhong

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引用次数: 0

摘要

在压力约束模式下对热超声倒装芯片(TSFC)进行了研究，该模式下倒装芯片受结合力约束。研究了键合参数对键合强度的影响。结果表明，结合力和超声功率是影响结合力的主要因素。结合强度与结合界面使用的超声能量有关，高结合强度需要适度的能量，能量过剩或不足都会导致结合强度低

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Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern

Thermosonic flip chip (TSFC) was performed and studied under the pressure constraint pattern, in which the flip chip is restricted by bonding force. Effects of bonding parameters on bonding strength were studied. Results show that bonding force and ultrasonic power have primary effects on bonding strength. The bonding strength is related to ultrasonic energy used in bonding interface, moderate energy is necessary for high bonding strength, and overabundance or inadequate of energy will cause low bonding strength

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Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.

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