多项目晶圆切割的比较研究

IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05) Pub Date : 2005-05-11 DOI:10.1109/ISVLSI.2005.3

Meng-Chiou Wu, Rung-Bin Lin

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引用次数: 10

摘要

本文对多项目晶圆的切割方法进行了比较研究。我们的切割方法可以减少40%的晶圆用于小批量和大批量生产。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A comparative study on dicing of multiple project wafers

This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume production.

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来源期刊

IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05)

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