研究半导体热电特性的专用硬件和软件

2020 IEEE 15th International Conference on Advanced Trends in Radioelectronics, Telecommunications and Computer Engineering (TCSET) Pub Date : 2020-02-01 DOI:10.1109/TCSET49122.2020.235411

R. Dunets, B. Dzundza, O. Kostyuk

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引用次数: 0

摘要

分析和选择了最适合软件和硬件实现的半导体热电参数研究方法。以哈曼方法及其修正为基础。已经确定了所需的工作范围，内存和性能资源，并开发了结构和电气图，以及用于研究块状和薄膜热电材料热电参数的专用计算机系统的软件。对成品模块的工作特性进行了快速分析。

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Specialized Hardware and Software for The Study of Thermoelectric Properties of Semiconductors

The methods of investigation of thermoelectric parameters of semiconductors, which are optimal for the implementation of software and hardware, are analyzed and selected. The Harman method and its modifications are taken as a basis. The required operating ranges, memory and performance resources have been identified, and a structural and electrical diagram has been developed, as well as software of a specialized computer system for the study of thermoelectric parameters of both massive and thin-film thermoelectric materials. A rapid analysis of the operational characteristics of the finished module has been designed.

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来源期刊

2020 IEEE 15th International Conference on Advanced Trends in Radioelectronics, Telecommunications and Computer Engineering (TCSET)

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