基于几何反弹簧的MEMS重力仪温度灵敏度及制造公差对其性能影响的仿真研究

Vinod Belwanshi, A. Prasad, K. Toland, K. Anastasiou, S. Bramsiepe, R. Middlemiss, D. Paul, G. Hammond
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引用次数: 0

摘要

在这项工作中,使用有限元分析(FEA)对基于几何反弹簧(GAS)的微机电系统(MEMS)重力仪的制造器件观察到的温度变化和制造公差的影响进行了建模。用挠曲温度系数(TCD)分析了不同截面的气体挠曲的温度诱导效应。仿真模型表明,最大TCD出现在挠曲的最小刚度工作点。模型还表明,由于制造公差导致的截面形状变化会显著影响刚度,从而影响器件的谐振频率。有趣的是,可以观察到,简化模型的温度灵敏度主要取决于器件材料(Si),而与截面曲线无关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Simulation Study of the Temperature Sensitivity and Impact of Fabrication Tolerances on the Performance of a Geometric Anti-Spring Based MEMS Gravimeter
In this work, the effect of temperature change and fabrication tolerances observed from fabricated devices for a geometric anti-spring (GAS) based Microelectromechanical Systems (MEMS) gravimeter is modelled using Finite Element Analysis (FEA). The temperature-induced effects are analysed in terms of the temperature coefficient of deflection (TCD) for GAS flexures of varying cross-section profiles. The simulated models suggest that the maximum TCD is observed at the minimum stiffness operating points of the flexures. The models also suggest that the cross-sectional shape changes due to fabrication tolerances significantly impact the stiffness, and, hence, the resonant frequency of the devices. Interestingly, it is observed that the temperature sensitivities of the simplified models are found to be mainly dependent on the device material (Si), irrespective of the cross-sectional profiles.
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