三维高k栅极双电FinFET短沟道效应的比较研究

R. M. Asif, S. Rehman, A. Rehman, M. Bajaj, S. Choudhury, T. Dash
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引用次数: 2

摘要

随着半导体技术的进步,FinFET取代了MOSFET。它具有抑制短通道效应、高频应用性能突出、功率控制好等优点,是前沿器件之一。本文提出了一种具有漏极电流、通道电荷和速度等不同分析模型的FinFET结构。设计了不同搭接长度的栅极氧化物介质材料,并比较了它们在SCE中的性能。对介电材料SiO2和Al2O3的短通道效应也进行了研究。利用所提出的模型对阈值门电压和漏极电流等关键参数,包括短通道效应进行了评估。给出了传输特性和输出特性。具有高k介电介质的FinFET具有更高的离子/开关比和更低的阈值电压。这些结果验证了所提出的模型可以降低SCE。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Comparative Study of Short Channel Effects in 3-D FinFET with High-K Gate Di-electric
With the advancement of Semiconductor Technology, FinFET replaces MOSFET. It is one of the frontier devices due to suppressed short channel effects, outstanding performance for high-frequency applications, and better power control. This paper proposed a FinFET structure with different analytical models for drain-current, channel charge, and velocity. The dielectric materials of different underlap lengths for gate oxide have been implemented and compared their performance for SCE. The short channel effects for dielectric materials SiO2, and Al2O3 are also examined. The critical parameters such as threshold gate voltages and drain current, including short channel effects have been evaluated using the proposed model. The transfer and output characteristics have been shown. FinFET with high-k dielectric shows higher Ion/Ioff ratio and reduced threshold voltage. These results validate the proposed model to reduce the SCE.
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