{"title":"采用准分布式TFMS线路的小型化90/spl度/混合电路","authors":"T. Tanaka, K. Nishikawa, M. Aikawa","doi":"10.1109/MWSYM.2004.1335886","DOIUrl":null,"url":null,"abstract":"In this paper, very miniaturized 90/spl deg/ hybrid circuit using quasi-distributed TFMS line is described. In a planar formed conventional MMIC's, the passive circuits such as 90/spl deg/ branch-line hybrid has occupied a large chip area. Therefore, it is strongly desired that the chip area is more miniaturized. For increasing integration level, the three-dimensional (3D) MMIC has been developed. In the 3D MMICs, meander-like lines are realized easily and many metal-insulator-metal (MIM) capacitors can be loaded on transmission lines. By the 3D MMIC topology, a transmission line composed of high impedance thin film microstrip (TFMS) lines and MIM capacitors are realized easily. This type TFMS transmission line is called \"quasi-distributed thin film microstrip (QD-TFMS) line\". A very small 90/spl deg/ branch-like hybrid using the QD-TFMS lines is realized. The fabricated 9/spl deg/ branch-like hybrid size is more than 80% smaller than that of conventional one compose of meander-like transmission lines in area.","PeriodicalId":334675,"journal":{"name":"2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Miniaturized 90/spl deg/ hybrid circuit using quasi-distributed TFMS line\",\"authors\":\"T. Tanaka, K. Nishikawa, M. Aikawa\",\"doi\":\"10.1109/MWSYM.2004.1335886\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, very miniaturized 90/spl deg/ hybrid circuit using quasi-distributed TFMS line is described. In a planar formed conventional MMIC's, the passive circuits such as 90/spl deg/ branch-line hybrid has occupied a large chip area. Therefore, it is strongly desired that the chip area is more miniaturized. For increasing integration level, the three-dimensional (3D) MMIC has been developed. In the 3D MMICs, meander-like lines are realized easily and many metal-insulator-metal (MIM) capacitors can be loaded on transmission lines. By the 3D MMIC topology, a transmission line composed of high impedance thin film microstrip (TFMS) lines and MIM capacitors are realized easily. This type TFMS transmission line is called \\\"quasi-distributed thin film microstrip (QD-TFMS) line\\\". A very small 90/spl deg/ branch-like hybrid using the QD-TFMS lines is realized. The fabricated 9/spl deg/ branch-like hybrid size is more than 80% smaller than that of conventional one compose of meander-like transmission lines in area.\",\"PeriodicalId\":334675,\"journal\":{\"name\":\"2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2004.1335886\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2004.1335886","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Miniaturized 90/spl deg/ hybrid circuit using quasi-distributed TFMS line
In this paper, very miniaturized 90/spl deg/ hybrid circuit using quasi-distributed TFMS line is described. In a planar formed conventional MMIC's, the passive circuits such as 90/spl deg/ branch-line hybrid has occupied a large chip area. Therefore, it is strongly desired that the chip area is more miniaturized. For increasing integration level, the three-dimensional (3D) MMIC has been developed. In the 3D MMICs, meander-like lines are realized easily and many metal-insulator-metal (MIM) capacitors can be loaded on transmission lines. By the 3D MMIC topology, a transmission line composed of high impedance thin film microstrip (TFMS) lines and MIM capacitors are realized easily. This type TFMS transmission line is called "quasi-distributed thin film microstrip (QD-TFMS) line". A very small 90/spl deg/ branch-like hybrid using the QD-TFMS lines is realized. The fabricated 9/spl deg/ branch-like hybrid size is more than 80% smaller than that of conventional one compose of meander-like transmission lines in area.