Adaptive Rule Based Order Release in Semiconductor Manufacturing

This paper analyzes two periodic order release mechanisms and their promising extensions by using a simulation model of a scaled-down wafer fabrication facility. One extends the Backward Infinite Loading (BIL) approach by dynamically adjusting lead times and considering safety lead times, and the other extends the COrrected aggregate Load Approach (COLA) by incorporating a dynamic time limit into its release procedure (Overload). Both are periodic approaches aiming at improving the timing performance and can react to the dynamics on the shop floor, where semiconductor manufacturing provides a very challenging environment. The results show that Overload outperforms all other mechanisms by yielding less total costs mainly due to a more balanced shop which results in the lowest WIP costs. Further, Overload reduces inventory costs compared to BIL and COLA. These results reinforce the finding of previous research that periodic rule based order release models are a viable alternative for semiconductor manufacturing.