电介质板剥离的微波测试

2009 International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory Pub Date : 2009-10-30 DOI:10.1109/DIPED.2009.5307269

V. R. Dzhala, L. I. Kapko

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引用次数: 0

摘要

提出了一种微波无损检测介质板剥离的方法。该方法基于5-mm波段的多频传感和反问题求解来确定介质结构的厚度。对该方法的精度和分辨率进行了评价。

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Microwave testing of exfoliation in a dielectric plate

A method of microwave non-destructive testing of exfoliation in a dielectric plate is developed. The proposed method is based on multi-frequency sensing in 5-mm waveband and solving of the inverse problem to determine dielectric structure's thickness. Precision and resolution of the proposed method are evaluated.

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来源期刊

2009 International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory

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