{"title":"模块化插入式高性能电源转换器总成","authors":"A. Solomon, A. Castellazzi, N. Delmonte, P. Cova","doi":"10.1109/EPE.2016.7695652","DOIUrl":null,"url":null,"abstract":"This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.","PeriodicalId":119358,"journal":{"name":"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Modular plug-in high-performance assembly of a power converter\",\"authors\":\"A. Solomon, A. Castellazzi, N. Delmonte, P. Cova\",\"doi\":\"10.1109/EPE.2016.7695652\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.\",\"PeriodicalId\":119358,\"journal\":{\"name\":\"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-09-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPE.2016.7695652\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPE.2016.7695652","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modular plug-in high-performance assembly of a power converter
This paper presents the work on an alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes addressing higher strength, higher toughness and higher thermal conductivity. The switch is totally bond wireless, since bonded wires increase self-heating and introduce further thermomechanical degradation mechanisms. Moreover, this solution is equipped with double side liquid cooling, and plug-in edge connectors both on the driver and load sides, allowing high power density, good accessibility and modularity. Preliminary experimental results show good switching behavior.