用于多层片对片互连的具有尺寸调制的方基长方体核心垂直光波导

S. Ran, T. Kakitsuka, K. Takahata
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引用次数: 0

摘要

:对于片对片互连,在不久的将来有望开发出Pbit/s级的传输能力。为了实现如此巨大的容量,芯片之间连接的多层光波导结构必不可少。为了改善光器件与波导之间的光耦合,本文提出了一种用于垂直光束在聚合物多层波导中传播的具有尺寸调制的方基长方体核结构。设计了一种具有非均匀长方体芯的10层聚合物波导,用于1.31 μ m的单模传输。通过波束传播方法的仿真,证实了该设计可以提供−4.4 dB的耦合效率,比先前报道的均匀立方体芯设计高3.8 dB, 10层结构的串扰为−20.6 dB。仿真结果表明,所提出的非均匀长方体核结构具有实现10层光波导结构的潜力,可用于未来具有巨大传输容量的片对片光互连。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vertical Optical Waveguide Comprising Square Base Cuboid Cores with Size Modulation for Multilayer Chip-to-Chip Interconnection
: For chip-to-chip interconnection, a Pbit/s-class transmission capacity is expected to be developed in near future. To achieve such a huge capacity, a multilayer optical waveguide structure for connection between chips is indispensable. In this paper, a square base cuboid-core structure with size modulation for vertical light beam propagation in a polymer multilayer waveguide is proposed for improving optical coupling between the optical devices and waveguide. A 10-layer polymer waveguide with nonuniform cuboid cores are designed for single-mode transmission at 1.31 μ m. Using a simulation based on the beam propagation method, it is confirmed that the proposed design can provide a coupling efficiency of − 4.4 dB, which is 3.8 dB higher than that of a previously reported uniform cube-core design, for the 10-layer structure and a crosstalk of − 20.6 dB. The simulated results show that the proposed nonuniform cuboid-core structure has the potential to realize a 10-layer optical waveguide structure for future chip-to-chip optical interconnection with a huge transmission capacity.
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