{"title":"基于叶脉网格的片上分形功率树网络","authors":"Huifen Huang, Qingxin Chu, Jiankang Xiao","doi":"10.1109/EDAPS.2009.5403999","DOIUrl":null,"url":null,"abstract":"In this paper, fractal power network has been proposed. The fractal structure is designed based on leaf vein. The simulated and measured results illustrate that the designed power network has greatly improved noise isolation, resistive and inductive voltage drop, and “Swiss Cheese” effect (There are many vias in the power plane just like many holes in Swiss Cheese. These via areas and their associated anti-pads forms high resistance areas and lead to the voltages or currents to the circuit — elements lower than design demand).","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A novel on-chip fractal power tree network based on leaf vein grids\",\"authors\":\"Huifen Huang, Qingxin Chu, Jiankang Xiao\",\"doi\":\"10.1109/EDAPS.2009.5403999\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, fractal power network has been proposed. The fractal structure is designed based on leaf vein. The simulated and measured results illustrate that the designed power network has greatly improved noise isolation, resistive and inductive voltage drop, and “Swiss Cheese” effect (There are many vias in the power plane just like many holes in Swiss Cheese. These via areas and their associated anti-pads forms high resistance areas and lead to the voltages or currents to the circuit — elements lower than design demand).\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5403999\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5403999","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A novel on-chip fractal power tree network based on leaf vein grids
In this paper, fractal power network has been proposed. The fractal structure is designed based on leaf vein. The simulated and measured results illustrate that the designed power network has greatly improved noise isolation, resistive and inductive voltage drop, and “Swiss Cheese” effect (There are many vias in the power plane just like many holes in Swiss Cheese. These via areas and their associated anti-pads forms high resistance areas and lead to the voltages or currents to the circuit — elements lower than design demand).