{"title":"紧凑的器件建模电路仿真","authors":"C. McAndrew","doi":"10.1109/CICC.1997.606604","DOIUrl":null,"url":null,"abstract":"This paper reviews issues related to compact modeling for circuit simulation. The major emphasis is to detail common-sense guidelines for compact modeling and characterization that are not so common, and to highlight common numerical weaknesses and their solution. Aspects of high frequency modeling that are often overlooked are also addressed.","PeriodicalId":111737,"journal":{"name":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Compact device modeling for circuit simulation\",\"authors\":\"C. McAndrew\",\"doi\":\"10.1109/CICC.1997.606604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reviews issues related to compact modeling for circuit simulation. The major emphasis is to detail common-sense guidelines for compact modeling and characterization that are not so common, and to highlight common numerical weaknesses and their solution. Aspects of high frequency modeling that are often overlooked are also addressed.\",\"PeriodicalId\":111737,\"journal\":{\"name\":\"Proceedings of CICC 97 - Custom Integrated Circuits Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-05-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of CICC 97 - Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1997.606604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1997.606604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper reviews issues related to compact modeling for circuit simulation. The major emphasis is to detail common-sense guidelines for compact modeling and characterization that are not so common, and to highlight common numerical weaknesses and their solution. Aspects of high frequency modeling that are often overlooked are also addressed.
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