变质HEMT沟道材料及栅极凹槽结构的改性研究

S. Choi, Y. Baek, Jung-hun Oh, Min Han, S. Bang, J. Rhee
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引用次数: 0

摘要

在本研究中,我们对传统的MHEMT(高电子迁移率晶体管)进行了沟道修改和栅极凹槽的改变。改进后的通道由In0.53Ga0.47 As层和InP层组成。由于InP比In0.53Ga0.47 As具有更低的冲击电离系数,我们在MHEMT中采用了InP复合通道。此外,栅极凹槽宽度是HEMT结构击穿和射频特性的函数。因此,我们研究了不同栅极凹槽宽度下MHEMT的击穿和射频特性。我们比较了inp复合通道与传统MHEMT通道的击穿特性。结果表明,与传统结构相比,inp复合通道MHEMT的导通和关断击穿电压分别提高了约20%和27%。此外,inp复合沟道MHEMT的击穿电压随栅极凹槽宽度的增加而增加。fmax随栅极凹槽宽度的减小而增大,fmax随栅极凹槽宽度的增大而增大。同时,我们提取了小信号参数。结果表明,与传统的MHEMT相比,inp复合通道MHEMT的Gd降低了约30%。因此,抑制inp复合通道中的冲击电离会增加击穿电压并降低输出电导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Studies on Modification of Channel Material and Gate Recess Structures in Metamorphic HEMT
In this study, we have performed both the channel modification of the conventional MHEMT (Metamorphic High Electron Mobility Transistor) and the variation of gate recess. The modified channel consists of the In0.53Ga0.47 As and the InP layers. Since InP has lower impact ionization coefficient than In0.53Ga0.47 As, we have adopted the InP-composite channel in the MHEMT. Also, the gate recess width is both functions of breakdown and RF characteristic of a HEMT structure. Therefore, we have studied the breakdown and RF characteristic for various gate recess widths of MHEMT's. We have compared breakdown characteristic of the InP-composite channel with that of conventional MHEMT's. It is shown that on and off state breakdown voltages of the InP-composite channel MHEMT were increased by about 20 and 27 %, respectively, compared with the conventional structure. Also, breakdown voltage of the InP-composite channel MHEMT was increased with increasing gate recess width. The fmax was increased with decreasing the gate recess width, whereas fmax was increased with increasing the gate recess width. Also, we extracted small-signal parameters. It was shown that Gd of the InP-composite channel MHEMT is decreased about by 30 % compared with the conventional MHEMT. Therefore, the suppression of the impact ionization in the InP-composite channel increases the breakdown voltage and decreases the output conductance.
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