碳纳米管和硅纳米线是未来纳米电子学的替代途径

V. Nosik
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摘要

如今,数以百万计的基本硅晶体管聚集成微芯片,可以被认为是20世纪微电子技术的象征,微电子技术已成为后工业社会的支柱,推动着人类生活的其他领域。硅技术已经达到了如此高的复杂程度,以至于集成电路(IC)尺寸的进一步进化缩小看起来不可能让位于革命性的想法和新材料。先前被认为是不可避免的硅选择顺序的明显限制因素:由于低电子/通道迁移率和巨大的互连电阻而导致速度降低;密实集成电路中由于漏电流、各种隧穿效应导致的功耗增加;制造和集成电路设计成本的充分上升,对缺陷的严格要求。尽管如此,“在底部仍有足够的空间”来容纳可以与硅竞争的新材料。未来几十年,IC产业将步入后路线图时代,届时器件参数的长期预测可能非常困难。介绍了碳纳米管(CNT)和硅纳米线(SiNW)等新材料在现代微纳米电子学中的应用。混合硅碳技术的一般方面和可能的路线图将被考虑,并通过最近在新加坡建立的意法半导体新碳纳米管中心获得的结果来说明。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Carbon Nanotubes and Si Nanowires as an Alternative Route to Future Nanoelectronics
Nowadays millions of elementary silicon transistors aggregated into microchips could be considered as a symbol of 20thcentury microelectronic technology which has become a spinal bone of postindustrial society propelling other areas of human life. Silicon technology has reached so high level of sophistication that the further evolutionary shrinking of the size of integrated circuits (IC) looks impossible giving way to the revolutionary ideas and new materials. There are obvious limiting factors which earlier have been considered as inevitable sequences of silicon choice: decrease of speed due to the low electron/channel mobility and great interconnect resistance; increase of power consumption due to the leakage currents, various tunneling effects in dense IC; sufficient rise of the manufacturing and IC design cost, rigid requirements on defects. Nevertheless “there is still enough space at the bottom” for new materials which could compete with silicon. Next decades IC industry should step into the post-Roadmap era when the long term anticipation of device parameters could be very difficult if possible at all. Presentation is devoted to the applications such new materials as Carbon NanoTubes (CNT) and silicon nanowires (SiNW) in modern micro and nano electronics. General aspects of hybrid silicon – carbon technologies and possible roadmaps will be considered and illustrated by the results obtained in new CNT center of STMicroelectronics recently established in Singapore.
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