优化标准CMOS工艺制备的硅雪崩光电二极管,用于8ghz工作

AtfyiFauzanbinMohammedNapiah Zul, K. Iiyama, Ryoichi Gyobu, Takuya Hishiki, T. Maruyama
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引用次数: 2

摘要

采用0.18 μm CMOS工艺制备了硅雪崩光电二极管(APD)。测量了带保护环和不带保护环的APD的电流电压特性和频率响应。在二极管结的周长周围有保护环,它在最大带宽方面表现出更好的性能,但相比之下响应性较低。为了提高带宽,射频探测的探测面积和PAD尺寸分别优化为10 × 10 μm2和30 × 30 μm2,为了减小器件电容,将数字间电极间距缩小到0.84 μm,以减少载流子的传递时间,并且由于载流子是慢扩散载流子,因此可以消除在深层和衬底中光产生的载流子。因此,最大带宽达到8 GHz,增益带宽产品达到280 GHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimizing silicon avalanche photodiode fabricated by standard CMOS process for 8 GHz operation
Silicon avalanche photodiode (APD) was fabricated by standard 0.18 μm CMOS process. The current-voltage characteristic and frequency response was measured for the APD with and without guard ring. With the guard ring around the perimeter of the diode junction, it shows a better performance for the maximum bandwidth but in contrast lower in responsivity. To enhance the bandwidth, the detection area and the PAD size for RF probing are optimized to 10 × 10 μm2 and 30 × 30 μm2, respectively, to decrease the device capacitance, the spacing of interdigital electrode is narrowed to 0.84 μm to decrease carrier transit time, and by cancelling the carriers photo-generated in the deep layer and the substrate because the carriers are slow diffusion carriers. As a result, the maximum bandwidth of 8 GHz was achieved along with a gain-bandwidth product of 280 GHz.
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