基于分段的x填充,低功耗和高缺陷覆盖率

Zhen Chen, D. Xiang, Boxue Yin
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引用次数: 3

摘要

在基于扫描的测试过程中,提出了许多x填充策略来降低测试功率。由于它们的主要动机是减少测试过程中测试模式的切换活动,其中一些容易降低测试模式的测试能力,从而可能导致较低的缺陷覆盖率。在本文中,我们提出了一种基于分段的x填充(SBF)技术,以减少使用多个扫描链的测试功率,对缺陷覆盖率的影响最小。与以前的填充方法不同,我们的x填充技术是基于分段的,并且可以识别缺陷覆盖率。该方法可以很容易地整合到传统的ATPG流程中,使捕获功率保持在一定限度以下,并使缺陷覆盖率保持在较高水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Segment based X-Filling for low power and high defect coverage
Many X-Filling strategies are proposed to reduce test power during scan based testing. Because their main motivation is to reduce the switching activities of test patterns in the test process, some of them are prone to reduce the test ability of test patterns, which may lead to low defect coverage. In this paper, we propose a segment based X-filling(SBF) technique to reduce test power using multiple scan chains, with minimal impact on defect coverage. Different from the previous filling methods, our X-filling technique is segment based and defect coverage aware. The method can be easily incorporated into traditional ATPG flow to keep capture power below a certain limit and keep the defect coverage at a high level.
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