{"title":"我们为什么要做3D集成?","authors":"W. Haensch","doi":"10.1145/1391469.1391643","DOIUrl":null,"url":null,"abstract":"3D integration offers a technology that meets the requirements of the current trend in high performance microprocessors. It offers the opportunity to continue the performance trends the industry enjoyed in the past. To take advantage of this opportunity system architecture and design needs to utilize the new possibilities that 3D integration provides.","PeriodicalId":412696,"journal":{"name":"2008 45th ACM/IEEE Design Automation Conference","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Why should we do 3D integration?\",\"authors\":\"W. Haensch\",\"doi\":\"10.1145/1391469.1391643\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"3D integration offers a technology that meets the requirements of the current trend in high performance microprocessors. It offers the opportunity to continue the performance trends the industry enjoyed in the past. To take advantage of this opportunity system architecture and design needs to utilize the new possibilities that 3D integration provides.\",\"PeriodicalId\":412696,\"journal\":{\"name\":\"2008 45th ACM/IEEE Design Automation Conference\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-06-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 45th ACM/IEEE Design Automation Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1391469.1391643\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 45th ACM/IEEE Design Automation Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1391469.1391643","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D integration offers a technology that meets the requirements of the current trend in high performance microprocessors. It offers the opportunity to continue the performance trends the industry enjoyed in the past. To take advantage of this opportunity system architecture and design needs to utilize the new possibilities that 3D integration provides.
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