基于多孔硅光致发光特性的环境气体传感

S. Buakaew, Atthawit Ausama, N. Atiwongsangthong
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引用次数: 0

摘要

利用多孔硅的光致发光强度特性响应环境气敏。以硅片为起始材料制备多孔硅样品,采用阳极氧化蚀刻工艺在p型硅衬底上制备多孔硅层。阳极氧化参数方面,采用的蚀刻电流在10 ~ 40 mA/cm2之间,以48%的氢氟酸浓度,蚀刻时间为10分钟。用扫描电子显微镜(SEM)描述了多孔硅的结构,并用重量法测定了样品的孔隙率。用室温下的光致发光强度来描述样品作为环境气体传感。多孔硅在氧气环境中储存的光致发光强度最差,真空中储存的光致发光强度最好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ambient Gases Sensing by Photoluminescence Properties of Porous Silicon
Ambient gas sensing was responced by photoluminescence intensity properties of porous silicon. Silicon wafer was used as starting material for porous silicon samples, anodization etching process was used to prepare porous silicon layer on p-type silicon substrate. Anodization parameters, the current etchings used between 10 to 40 mA/cm2, with 48% hydrofluoric acid concentration and etching time of 10 minutes. The porous silicon structure were described by using SEM and the porosity of samples by gravimetric technique. The samples were applied as ambient gas sensing were described by photoluminescence intensity at room temperature. The bad of photoluminescence intensity when porous silicon was stored in oxygen ambient gas and the best of photoluminescence intensity was to vacuum.
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