{"title":"一种基于单盘双面结构的ka波段空间功率组合放大器","authors":"Zhongbo Zhu, S. Dong, Wei Ma, Jun Xu","doi":"10.1109/ICCT.2008.4716237","DOIUrl":null,"url":null,"abstract":"In this paper, we present a Ka-band power combining amplifier based on a new single double faced tray architecture. Using 4 off-the-shelf GaAs monolithic-microwave integerated-circuit (MMIC) power amplifiers with double antipodal finline power splitting/combining antenna arrays, the power combining circuit can produced up to 83% of combining efficient. Taking one with another, the new combining architecture shows many advantages, such as small size, excellent heat-sinking capacity, high efficiency and so on. The modular architecture also allows easy maintenance, variable output power level, and modular assembly.Results on graceful degradation are also presented, showing superb tolerance to device failure.","PeriodicalId":259577,"journal":{"name":"2008 11th IEEE International Conference on Communication Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Ka-band spatial power combining amplifier based on sigle tray and double-faced architecture\",\"authors\":\"Zhongbo Zhu, S. Dong, Wei Ma, Jun Xu\",\"doi\":\"10.1109/ICCT.2008.4716237\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a Ka-band power combining amplifier based on a new single double faced tray architecture. Using 4 off-the-shelf GaAs monolithic-microwave integerated-circuit (MMIC) power amplifiers with double antipodal finline power splitting/combining antenna arrays, the power combining circuit can produced up to 83% of combining efficient. Taking one with another, the new combining architecture shows many advantages, such as small size, excellent heat-sinking capacity, high efficiency and so on. The modular architecture also allows easy maintenance, variable output power level, and modular assembly.Results on graceful degradation are also presented, showing superb tolerance to device failure.\",\"PeriodicalId\":259577,\"journal\":{\"name\":\"2008 11th IEEE International Conference on Communication Technology\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 11th IEEE International Conference on Communication Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCT.2008.4716237\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 11th IEEE International Conference on Communication Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCT.2008.4716237","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Ka-band spatial power combining amplifier based on sigle tray and double-faced architecture
In this paper, we present a Ka-band power combining amplifier based on a new single double faced tray architecture. Using 4 off-the-shelf GaAs monolithic-microwave integerated-circuit (MMIC) power amplifiers with double antipodal finline power splitting/combining antenna arrays, the power combining circuit can produced up to 83% of combining efficient. Taking one with another, the new combining architecture shows many advantages, such as small size, excellent heat-sinking capacity, high efficiency and so on. The modular architecture also allows easy maintenance, variable output power level, and modular assembly.Results on graceful degradation are also presented, showing superb tolerance to device failure.
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