添加元素对Sn-Bi钎料高温裂纹扩展行为的影响

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Pub Date : 2014-12-01 DOI:10.1109/EPTC.2014.7028297

N. Hiyoshi, M. Yamashita, H. Hokazono

{"title":"添加元素对Sn-Bi钎料高温裂纹扩展行为的影响","authors":"N. Hiyoshi, M. Yamashita, H. Hokazono","doi":"10.1109/EPTC.2014.7028297","DOIUrl":null,"url":null,"abstract":"This paper discusses the effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures. Sn-Bi solders are lower melting point materials, so that it is useful for low temperature soldering. Crack initiation and propagation behavior of three kinds of Sn-Bi solders were observed in this study. There were effects of additive elements Ag, Cu, Ni and Ge on crack propagation rate although there was no effect on crack initiation. The crack propagation of Sn57.5Bi0.5AgCuNiGe solder seems to have a slower rate than Sn58Bi and Sn57.5Bi0.5Ag solders. The J-integral range parameter evaluates the crack propagation rate independent of the additive elements at high temperatures.","PeriodicalId":115713,"journal":{"name":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures\",\"authors\":\"N. Hiyoshi, M. Yamashita, H. Hokazono\",\"doi\":\"10.1109/EPTC.2014.7028297\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures. Sn-Bi solders are lower melting point materials, so that it is useful for low temperature soldering. Crack initiation and propagation behavior of three kinds of Sn-Bi solders were observed in this study. There were effects of additive elements Ag, Cu, Ni and Ge on crack propagation rate although there was no effect on crack initiation. The crack propagation of Sn57.5Bi0.5AgCuNiGe solder seems to have a slower rate than Sn58Bi and Sn57.5Bi0.5Ag solders. The J-integral range parameter evaluates the crack propagation rate independent of the additive elements at high temperatures.\",\"PeriodicalId\":115713,\"journal\":{\"name\":\"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2014.7028297\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2014.7028297","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文讨论了添加元素对Sn-Bi钎料高温裂纹扩展行为的影响。锡铋焊料是熔点较低的材料，因此适用于低温焊接。研究了三种锡铋钎料的裂纹萌生和扩展行为。添加元素Ag、Cu、Ni和Ge对裂纹扩展速率有影响，但对裂纹起裂没有影响。Sn57.5Bi0.5AgCuNiGe钎料的裂纹扩展速率似乎比Sn58Bi和Sn57.5Bi0.5Ag钎料慢。j积分范围参数评估了高温下与添加元素无关的裂纹扩展速率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures

This paper discusses the effect of additive elements on crack propagation behavior for Sn-Bi solders at high temperatures. Sn-Bi solders are lower melting point materials, so that it is useful for low temperature soldering. Crack initiation and propagation behavior of three kinds of Sn-Bi solders were observed in this study. There were effects of additive elements Ag, Cu, Ni and Ge on crack propagation rate although there was no effect on crack initiation. The crack propagation of Sn57.5Bi0.5AgCuNiGe solder seems to have a slower rate than Sn58Bi and Sn57.5Bi0.5Ag solders. The J-integral range parameter evaluates the crack propagation rate independent of the additive elements at high temperatures.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

自引率

0.00%

发文量