{"title":"光电封装技术的最后1米","authors":"J. Sasaki, S. Hiramatsu, H. Kikuchi","doi":"10.1109/HPSR.2002.1024626","DOIUrl":null,"url":null,"abstract":"ASET's R&D efforts on opto-electronics packaging technology for terabit throughput are reviewed. To establish opto-electronics packaging technologies for high-speed routers and information appliances, we have been researching the following areas; an OE-MCM (Opto-Electronic Multi Chip Module) for low-cost high-speed processing, an AIP (Active-Interposer) for LSIs that increases bit rate (>1.25 Gbps) and makes for a smaller interface with optical signals, and an OE-board with optical right-angled multi-channel connectors for three-dimensional board-level assembly structures. We will demonstrate the following packaging technologies: ( 1 ) Optical waveguide film lamination technique: This technique is versatile and reduces the cost of the OE-MCM. The waveguide film has a 0.3-0.5 dB/c:m loss and is laminated on the printed circuit board. (2) AIP: The driver and receiver ICs, photo diode and laser diode are three-dimensionally stacked and integrated. (3) Self-written Waveguide: The waveguide exploits a unique automatic fiber-coupling method. Optical coupling is complete even if there is a few dozen of microns miss-alignment between fibers. (4) SMOP (Small MultdDemultiplexer consisting of Optical Elements): This is a compact MultVDemultiplexer for four-wavelength CWDM (Coarse Wavelength Division Multiplexing) of the same dimension as the MT ferrule. ( 5 ) Opto-electronic Subrack: This device consists of an optical backplane, fiber bending right-angled multi-channel connectors, optical boards and OE-MCMs. This work was performed under the management of ASET and was supported by NED0 (New Energy and industrial technology Development Organization)","PeriodicalId":180090,"journal":{"name":"Workshop on High Performance Switching and Routing, Merging Optical and IP Technologie","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Opto-electronies packaging technology for the last 1 m\",\"authors\":\"J. Sasaki, S. Hiramatsu, H. Kikuchi\",\"doi\":\"10.1109/HPSR.2002.1024626\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ASET's R&D efforts on opto-electronics packaging technology for terabit throughput are reviewed. To establish opto-electronics packaging technologies for high-speed routers and information appliances, we have been researching the following areas; an OE-MCM (Opto-Electronic Multi Chip Module) for low-cost high-speed processing, an AIP (Active-Interposer) for LSIs that increases bit rate (>1.25 Gbps) and makes for a smaller interface with optical signals, and an OE-board with optical right-angled multi-channel connectors for three-dimensional board-level assembly structures. We will demonstrate the following packaging technologies: ( 1 ) Optical waveguide film lamination technique: This technique is versatile and reduces the cost of the OE-MCM. The waveguide film has a 0.3-0.5 dB/c:m loss and is laminated on the printed circuit board. (2) AIP: The driver and receiver ICs, photo diode and laser diode are three-dimensionally stacked and integrated. (3) Self-written Waveguide: The waveguide exploits a unique automatic fiber-coupling method. Optical coupling is complete even if there is a few dozen of microns miss-alignment between fibers. (4) SMOP (Small MultdDemultiplexer consisting of Optical Elements): This is a compact MultVDemultiplexer for four-wavelength CWDM (Coarse Wavelength Division Multiplexing) of the same dimension as the MT ferrule. ( 5 ) Opto-electronic Subrack: This device consists of an optical backplane, fiber bending right-angled multi-channel connectors, optical boards and OE-MCMs. This work was performed under the management of ASET and was supported by NED0 (New Energy and industrial technology Development Organization)\",\"PeriodicalId\":180090,\"journal\":{\"name\":\"Workshop on High Performance Switching and Routing, Merging Optical and IP Technologie\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Workshop on High Performance Switching and Routing, Merging Optical and IP Technologie\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HPSR.2002.1024626\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Workshop on High Performance Switching and Routing, Merging Optical and IP Technologie","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HPSR.2002.1024626","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Opto-electronies packaging technology for the last 1 m
ASET's R&D efforts on opto-electronics packaging technology for terabit throughput are reviewed. To establish opto-electronics packaging technologies for high-speed routers and information appliances, we have been researching the following areas; an OE-MCM (Opto-Electronic Multi Chip Module) for low-cost high-speed processing, an AIP (Active-Interposer) for LSIs that increases bit rate (>1.25 Gbps) and makes for a smaller interface with optical signals, and an OE-board with optical right-angled multi-channel connectors for three-dimensional board-level assembly structures. We will demonstrate the following packaging technologies: ( 1 ) Optical waveguide film lamination technique: This technique is versatile and reduces the cost of the OE-MCM. The waveguide film has a 0.3-0.5 dB/c:m loss and is laminated on the printed circuit board. (2) AIP: The driver and receiver ICs, photo diode and laser diode are three-dimensionally stacked and integrated. (3) Self-written Waveguide: The waveguide exploits a unique automatic fiber-coupling method. Optical coupling is complete even if there is a few dozen of microns miss-alignment between fibers. (4) SMOP (Small MultdDemultiplexer consisting of Optical Elements): This is a compact MultVDemultiplexer for four-wavelength CWDM (Coarse Wavelength Division Multiplexing) of the same dimension as the MT ferrule. ( 5 ) Opto-electronic Subrack: This device consists of an optical backplane, fiber bending right-angled multi-channel connectors, optical boards and OE-MCMs. This work was performed under the management of ASET and was supported by NED0 (New Energy and industrial technology Development Organization)