动态集群芯片多处理器

Chao-Chin Wu, Guan-Joe Lai
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引用次数: 0

摘要

芯片多处理器(cmp)只有在具有充分线程级并行性的应用程序中才能优于超标量处理器。在本文中,我们研究了如何结合CMP和超标量的优点来执行应用程序。我们将CMP中的多个处理元素(pe)聚合成一个宽超标量处理器。聚合pe的数量由运行时后续线程的依赖距离动态确定。根据不同的聚合方式,新的CMP能够支持三种执行模式。为了获得最佳性能,处理器在执行应用程序时,根据后续指令的特点,在不同的执行模式之间不断切换。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A dynamically clustered chip multiprocessor
Chip multiprocessors (CMPs) can outperform superscalar processors only for the application programs with full of thread-level parallelism. In this paper, we investigate how to combine both the advantages of a CMP and of a superscalar to execute an application. We aggregate multiple processing elements (PEs) in the CMP into a wide superscalar processor. The number of aggregated PEs is dynamically determined by the dependence distance of subsequent thread at the run time. According to different aggregation methods, the new CMP is capable of supporting three execution modes. To obtain the best performance, the processor keeps switching between different execution modes when executing an application, according to the characteristics of subsequent instructions.
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