多环境载荷下PBGA的加速试验与有限元分析

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI:10.1109/BEPRL.2004.1308157

H. Qi, S. Ganesan, M. Osterman, M. Pecht

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引用次数: 15

摘要

为了研究航空航天应用中塑料球栅阵列(PBGA)封装的长期可靠性，对未充填料和未充填料封装在板级多重环境载荷下进行了加速试验。本文讨论了试验结果及下填量对焊点可靠性的影响。通过对试验试样的失效分析，确定了失效模式和失效部位。为了更好地了解PBGAs在循环热载荷环境下的热力学行为，还开发了未充填料和未充填料的三维有限元模型，并用于预测失效时间。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Accelerated testing and finite element analysis of PBGA under multiple environmental loadings

To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace applications, accelerated tests were conducted to non-underfilled and underfilled packages under multiple environmental loadings at board level. This paper discusses the test results and the underfill effect on solder joint reliability. Failure modes and sites were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGAs under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure.

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Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)

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