J. Jing, Susan Wu, Xin Wu, P. Upadhyaya, Ade Bekele
{"title":"用于 FinFET 技术高速收发器设计的新型 MOS 变容器设备优化和建模","authors":"J. Jing, Susan Wu, Xin Wu, P. Upadhyaya, Ade Bekele","doi":"10.1109/IEDM.2016.7838500","DOIUrl":null,"url":null,"abstract":"For the first time, an optimized MOS varactor device design and a new physical based varactor model for advanced FinFET process is presented for high speed analog applications. The varactor is optimized in process and cell design to achieve high tuning range and low jitter for PLL design. A new physical BSIMCMG based varactor model is developed with RF components to fully describe the 3D device in FinFET technology for high frequency applications. The power dependent varactor CV characteristics and modeling for accurate VCO simulation is described. The new varactor device and model has been validated in 32.75 GB/s high speed transceiver design in 16nm FinFET technology.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Novel MOS varactor device optimization and modeling for high-speed transceiver design in FinFET technology\",\"authors\":\"J. Jing, Susan Wu, Xin Wu, P. Upadhyaya, Ade Bekele\",\"doi\":\"10.1109/IEDM.2016.7838500\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For the first time, an optimized MOS varactor device design and a new physical based varactor model for advanced FinFET process is presented for high speed analog applications. The varactor is optimized in process and cell design to achieve high tuning range and low jitter for PLL design. A new physical BSIMCMG based varactor model is developed with RF components to fully describe the 3D device in FinFET technology for high frequency applications. The power dependent varactor CV characteristics and modeling for accurate VCO simulation is described. The new varactor device and model has been validated in 32.75 GB/s high speed transceiver design in 16nm FinFET technology.\",\"PeriodicalId\":186544,\"journal\":{\"name\":\"2016 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2016.7838500\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2016.7838500","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel MOS varactor device optimization and modeling for high-speed transceiver design in FinFET technology
For the first time, an optimized MOS varactor device design and a new physical based varactor model for advanced FinFET process is presented for high speed analog applications. The varactor is optimized in process and cell design to achieve high tuning range and low jitter for PLL design. A new physical BSIMCMG based varactor model is developed with RF components to fully describe the 3D device in FinFET technology for high frequency applications. The power dependent varactor CV characteristics and modeling for accurate VCO simulation is described. The new varactor device and model has been validated in 32.75 GB/s high speed transceiver design in 16nm FinFET technology.