原子探针断层扫描样品制备的研究进展

2006 19th International Vacuum Nanoelectronics Conference Pub Date : 2006-07-01 DOI:10.1109/IVNC.2006.335333

D. Larson, K. Thompson, D. Lawrence, S. Kostrna, T. Prosa, R. Ulfig, T. Kelly

{"title":"原子探针断层扫描样品制备的研究进展","authors":"D. Larson, K. Thompson, D. Lawrence, S. Kostrna, T. Prosa, R. Ulfig, T. Kelly","doi":"10.1109/IVNC.2006.335333","DOIUrl":null,"url":null,"abstract":"This paper presents several advances made in the areas of 1) automated electropolishing of metals, 2) specimen preparation for grain boundary analysis, 3) site-specific specimen preparation for semiconductor devices, and 4) low-energy focused ion beam (FIB) milling to reduce the extent of ion-induced damage during the generic FIB preparation process","PeriodicalId":108834,"journal":{"name":"2006 19th International Vacuum Nanoelectronics Conference","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Advances in Specimen Preparation for Atom Probe Tomography\",\"authors\":\"D. Larson, K. Thompson, D. Lawrence, S. Kostrna, T. Prosa, R. Ulfig, T. Kelly\",\"doi\":\"10.1109/IVNC.2006.335333\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents several advances made in the areas of 1) automated electropolishing of metals, 2) specimen preparation for grain boundary analysis, 3) site-specific specimen preparation for semiconductor devices, and 4) low-energy focused ion beam (FIB) milling to reduce the extent of ion-induced damage during the generic FIB preparation process\",\"PeriodicalId\":108834,\"journal\":{\"name\":\"2006 19th International Vacuum Nanoelectronics Conference\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 19th International Vacuum Nanoelectronics Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IVNC.2006.335333\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 19th International Vacuum Nanoelectronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVNC.2006.335333","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文介绍了以下几个方面的进展:1)金属的自动电抛光，2)晶界分析的样品制备，3)半导体器件的特定位置样品制备，以及4)低能量聚焦离子束(FIB)铣削以减少普通FIB制备过程中离子诱导损伤的程度

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Advances in Specimen Preparation for Atom Probe Tomography

This paper presents several advances made in the areas of 1) automated electropolishing of metals, 2) specimen preparation for grain boundary analysis, 3) site-specific specimen preparation for semiconductor devices, and 4) low-energy focused ion beam (FIB) milling to reduce the extent of ion-induced damage during the generic FIB preparation process

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2006 19th International Vacuum Nanoelectronics Conference

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