标准CMOS技术中用于高压DC-AC转换的堆叠全桥拓扑结构

P. Callemeyn, M. Steyaert
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引用次数: 1

摘要

采用d类半桥拓扑结构,采用130 nm 1.2V CMOS技术实现单片DC-AC变换器。几个芯片组合在一起实现全桥拓扑,实现双极输出电压。使用堆叠技术,可以增加输出电压。这产生交流输出电压高达4V,这是该技术标称1.2V电源电压的三倍多。无源器件集成在芯片上。因此,大大减少了物料清单(BOM)。在标准的半桥拓扑中,需要笨重的外部电容器来滤除直流偏置。片外电容的这一主要障碍在全桥拓扑中得到了缓解,从而进一步降低了BOM。输出峰对峰电压为3.8V,最大效率为58.3%。总输出功率为56mW。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A stacked full-bridge topology for high voltage DC-AC conversion in standard CMOS technology
A monolithic DC-AC converter is realized in a 130 nm 1.2V CMOS technology using a Class-D half-bridge topology. Several dies are combined to achieve a full-bridge topology, realizing a bipolar output voltage. Using a stacking technique, this output voltage can be increased. This yields AC output voltages up to 4V, which is more than three times the nominal 1.2V supply voltage of the technology. The passives are integrated on-chip. Consequently, the bill of materials (BOM) is heavily reduced. In a standard half-bridge topology, bulky external capacitors are needed to filter out the DC offset. This main obstacle of an off-chip capacitor is alleviated in the full-bridge topology, reducing the BOM even more. An output peak-to-peak voltage of 3.8V is achieved at a maximal efficiency of 58.3%. A total output power of 56mW is obtained.
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