超小型焊点的蠕变行为和显微组织

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765827

S. Wiese, M. Mueller, I. Panchenko, R. Metasch, K. Wolter

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引用次数: 1

摘要

锡基钎料的蠕变行为受显著的结垢效应影响。因此，本文比较了在大体积样品和小焊点上获得的蠕变数据。采用光学显微技术和扫描电镜分析对试样和焊点进行金相切片后的显微组织性能进行了研究。这些微观组织分析的结果与所研究的焊料力学性能有关。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The creep behaviour and microstructure of ultra small solder joints

The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.

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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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