HS3DPG:三维P/G网络分层仿真

2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) Pub Date : 2013-04-29 DOI:10.1109/ASPDAC.2013.6509647

Shuai Tao, Xiaoming Chen, Yu Wang, Yuchun Ma, Yiyu Shi, Hui Wang, Huazhong Yang

{"title":"HS3DPG:三维P/G网络分层仿真","authors":"Shuai Tao, Xiaoming Chen, Yu Wang, Yuchun Ma, Yiyu Shi, Hui Wang, Huazhong Yang","doi":"10.1109/ASPDAC.2013.6509647","DOIUrl":null,"url":null,"abstract":"As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"HS3DPG: Hierarchical simulation for 3D P/G network\",\"authors\":\"Shuai Tao, Xiaoming Chen, Yu Wang, Yuchun Ma, Yiyu Shi, Hui Wang, Huazhong Yang\",\"doi\":\"10.1109/ASPDAC.2013.6509647\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.\",\"PeriodicalId\":297528,\"journal\":{\"name\":\"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASPDAC.2013.6509647\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2013.6509647","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

由于不同的芯片在3D集成电路中堆叠在一起，因此电源/地(P/G)网络模拟比2D情况更具挑战性。本文提出了一种适合于三维P/G网络(HS3DPG)的分层仿真方法，该方法可以保证完全并行性和随层数的增加而具有良好的可扩展性。在IR下降分析中，当有9层时，分层方法可以比直接全网络模拟快6.5倍。通过工业设计的三维P/G网络验证了HS3DPG的精度。此外，我们在HS3DPG中引入了“局部性”属性，进一步简化了仿真。最后，利用HS3DPG分析了具有聚类tsv的三维P/G网络的电压分布。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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HS3DPG: Hierarchical simulation for 3D P/G network

As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.

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2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)

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