{"title":"设计高功率 X 波段 T/R 模块","authors":"Yi Zhao, Bin Sun, Jianhua Xu","doi":"10.23919/CISS51089.2021.9652286","DOIUrl":null,"url":null,"abstract":"With the development of radar technology, the technology of microwave monolithic integrated circuit is becoming more and more mature. Miniaturized, lightweight, multifunctional millimeter wave radar has been deeply studied and applied at home and abroad. T/R module is the core component of active phased array radar. A high-power T/R component of x-band with four-channels has been studied and designed in this paper. In this paper, a suitable chip carrier is selected to solve the heat dissipation problem caused by the high-power chip through the establishment of heat dissipation model. By embedding the microwave transmission signal in the inner layer, the self-excitation risk is reduced. The partition wall is introduced between the multi-function chip and the driving amplifier or between the driving amplifier and the power amplifier, and the self-excitation problem of the transmitting link is solved.","PeriodicalId":318218,"journal":{"name":"2021 2nd China International SAR Symposium (CISS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of an X-band T/R module with high power\",\"authors\":\"Yi Zhao, Bin Sun, Jianhua Xu\",\"doi\":\"10.23919/CISS51089.2021.9652286\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the development of radar technology, the technology of microwave monolithic integrated circuit is becoming more and more mature. Miniaturized, lightweight, multifunctional millimeter wave radar has been deeply studied and applied at home and abroad. T/R module is the core component of active phased array radar. A high-power T/R component of x-band with four-channels has been studied and designed in this paper. In this paper, a suitable chip carrier is selected to solve the heat dissipation problem caused by the high-power chip through the establishment of heat dissipation model. By embedding the microwave transmission signal in the inner layer, the self-excitation risk is reduced. The partition wall is introduced between the multi-function chip and the driving amplifier or between the driving amplifier and the power amplifier, and the self-excitation problem of the transmitting link is solved.\",\"PeriodicalId\":318218,\"journal\":{\"name\":\"2021 2nd China International SAR Symposium (CISS)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 2nd China International SAR Symposium (CISS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/CISS51089.2021.9652286\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 2nd China International SAR Symposium (CISS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/CISS51089.2021.9652286","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
随着雷达技术的发展,微波单片集成电路技术日趋成熟。小型化、轻量化、多功能毫米波雷达已在国内外得到深入研究和应用。T/R模块是有源相控阵雷达的核心部件。本文研究并设计了一种具有四通道的 x 波段大功率 T/R 组件。本文选择了合适的芯片载体,通过建立散热模型,解决了大功率芯片带来的散热问题。通过将微波传输信号嵌入内层,降低了自激风险。在多功能芯片与驱动放大器之间或驱动放大器与功率放大器之间引入隔墙,解决了发射链路的自激问题。
With the development of radar technology, the technology of microwave monolithic integrated circuit is becoming more and more mature. Miniaturized, lightweight, multifunctional millimeter wave radar has been deeply studied and applied at home and abroad. T/R module is the core component of active phased array radar. A high-power T/R component of x-band with four-channels has been studied and designed in this paper. In this paper, a suitable chip carrier is selected to solve the heat dissipation problem caused by the high-power chip through the establishment of heat dissipation model. By embedding the microwave transmission signal in the inner layer, the self-excitation risk is reduced. The partition wall is introduced between the multi-function chip and the driving amplifier or between the driving amplifier and the power amplifier, and the self-excitation problem of the transmitting link is solved.