{"title":"紧凑脉冲多通道传输模块(MTM)","authors":"Rohit Lahiri, Ruchit Ms, H. M. V","doi":"10.1109/IMaRC45935.2019.9118764","DOIUrl":null,"url":null,"abstract":"This paper describes the design and realization of compact pulsed X-band multichannel transmit module for RADAR application. The module amplifies lower power RF signal fed to the input of this module, and then splits this RF power to individual channels, conditions and further amplifies to the desired saturated output before feeding it to antenna port of each channel. The entire module operates for 900MHz BW in X-Band, with each channel capable of generating saturated pulsed power of 23W(min) for a range pulse widths 50nsec to 100μsecs and duty cycle of maximum up to 20%. The entire module is realized on a single multilayer composite board and enclosed on a mechanical enclosure of 100x66x9 mm³ and weighing about 100gms. Controls & supply to this module is through compact Nano-d connector. The interface to the module is SPI.","PeriodicalId":338001,"journal":{"name":"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Compact Pulsed Multichannel Transmit Module (MTM)\",\"authors\":\"Rohit Lahiri, Ruchit Ms, H. M. V\",\"doi\":\"10.1109/IMaRC45935.2019.9118764\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the design and realization of compact pulsed X-band multichannel transmit module for RADAR application. The module amplifies lower power RF signal fed to the input of this module, and then splits this RF power to individual channels, conditions and further amplifies to the desired saturated output before feeding it to antenna port of each channel. The entire module operates for 900MHz BW in X-Band, with each channel capable of generating saturated pulsed power of 23W(min) for a range pulse widths 50nsec to 100μsecs and duty cycle of maximum up to 20%. The entire module is realized on a single multilayer composite board and enclosed on a mechanical enclosure of 100x66x9 mm³ and weighing about 100gms. Controls & supply to this module is through compact Nano-d connector. The interface to the module is SPI.\",\"PeriodicalId\":338001,\"journal\":{\"name\":\"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMaRC45935.2019.9118764\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE MTT-S International Microwave and RF Conference (IMARC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMaRC45935.2019.9118764","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes the design and realization of compact pulsed X-band multichannel transmit module for RADAR application. The module amplifies lower power RF signal fed to the input of this module, and then splits this RF power to individual channels, conditions and further amplifies to the desired saturated output before feeding it to antenna port of each channel. The entire module operates for 900MHz BW in X-Band, with each channel capable of generating saturated pulsed power of 23W(min) for a range pulse widths 50nsec to 100μsecs and duty cycle of maximum up to 20%. The entire module is realized on a single multilayer composite board and enclosed on a mechanical enclosure of 100x66x9 mm³ and weighing about 100gms. Controls & supply to this module is through compact Nano-d connector. The interface to the module is SPI.