不同时效方法对焊点组织的影响

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887593

A. Pietrikova, J. Ďurišin, M. Bazu, V. Ilian

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引用次数: 1

摘要

研究了阻尼热和热循环对焊点显微组织和显微硬度的影响。采用气相回流焊和热风回流焊制备了焊点。显微组织分析结果表明，时效对焊点空隙和裂纹的扩展有显著影响。

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Influence of different methods of ageing on microstructure of solder joints

An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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