Zhongfu Zhou, S. Khanniche, N. Jankovic, S. Batcup, P. Igić
{"title":"三相逆变驱动系统中PWM信号驱动功率器件的动态热仿真","authors":"Zhongfu Zhou, S. Khanniche, N. Jankovic, S. Batcup, P. Igić","doi":"10.1109/EPEPEMC.2006.283395","DOIUrl":null,"url":null,"abstract":"Fast power devices thermal simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic thermal simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the thermal simulation. With the proposed method, a relative large simulation time step can be employed and simulation speed can be increased dramatically. The method is suitable for a long real time thermal simulation for complex power electronics systems.","PeriodicalId":401288,"journal":{"name":"2006 12th International Power Electronics and Motion Control Conference","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Dynamic Thermal Simulation of Power Devices Operating with PWM Signals in a Three-Phase Inverter Drive System\",\"authors\":\"Zhongfu Zhou, S. Khanniche, N. Jankovic, S. Batcup, P. Igić\",\"doi\":\"10.1109/EPEPEMC.2006.283395\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fast power devices thermal simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic thermal simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the thermal simulation. With the proposed method, a relative large simulation time step can be employed and simulation speed can be increased dramatically. The method is suitable for a long real time thermal simulation for complex power electronics systems.\",\"PeriodicalId\":401288,\"journal\":{\"name\":\"2006 12th International Power Electronics and Motion Control Conference\",\"volume\":\"90 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 12th International Power Electronics and Motion Control Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPEMC.2006.283395\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 12th International Power Electronics and Motion Control Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPEMC.2006.283395","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dynamic Thermal Simulation of Power Devices Operating with PWM Signals in a Three-Phase Inverter Drive System
Fast power devices thermal simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic thermal simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the thermal simulation. With the proposed method, a relative large simulation time step can be employed and simulation speed can be increased dramatically. The method is suitable for a long real time thermal simulation for complex power electronics systems.