一款高度集成的双频三模收发器芯片组，适用于CDMA TIA/EIA-95和AMPS应用

2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096) Pub Date : 2000-06-10 DOI:10.1109/RFIC.2000.854459

T. Robinson, S. Lloyd, P. Piriyapoksombut, K. Rampmeier, M. Reddy, D. Yates

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引用次数: 14

摘要

针对双频双模CDMA/AMPS蜂窝电话标准TIA/EIA-98，设计了一种集成射频收发前端功能的双器件芯片组。该收发器采用双多晶硅，25 GHz f/sub / T/硅双极工艺制造，在3 V和9 dBm发射功率下实现了小于480 mW的总功耗。

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A highly integrated dual-band tri-mode transceiver chipset for CDMA TIA/EIA-95 and AMPS applications

In this paper, a two device chip-set integrating the RF transceiver front-end function for the dual-band, dual-mode CDMA/AMPS cellular telephone standard TIA/EIA-98 is described. Fabricated in a double-polysilicon, 25 GHz f/sub T/, silicon bipolar process, the transceiver achieves a total power dissipation of less than 480 mW at 3 V with 9 dBm transmitter power.

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2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096)

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