介质谐振器天线的研究

Surendra Kota, N. Gunavathi
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引用次数: 0

摘要

近十年来,无线通信的领域不断扩大。第二代(2G)的成功推动了宽带3G、4G、蜂窝电话等无线产品和服务的发展,包括WLAN、本地多点分布式网络(LMDS)、家庭射频、蓝牙等。无线网络的关键部件是天线。尽管我们的城市充斥着各种形状的天线,但我们更喜欢安全、低回波损耗、低功耗、多功能和多频段的设备。无线领域的微带天线和介电谐振天线(DRAs)等高效、小尺寸、低轮廓天线的发展将满足上述需求。与其他天线相比,介质谐振天线在较高频率下的金属损耗可以忽略不计,因此备受青睐。本文分析了如何提高半球形DRA的阻抗带宽,特别是在Wi-Fi应用中,并比较了不同层和矩形DRA的HDRA特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation on dielectric resonator antennas
The area of wireless communications has been increased from last decade. The success of the second-generation(2G) motivates the development of wideband 3G, 4G, cellular phones and other wireless products and services, including WLAN, local multi-point distributed networks(LMDS), home RF, Bluetooth etc. The crucial component of wireless network is the antenna. Even though our cities flooded with antenna of different kinds of shapes, maximum we prefer safety, low return loss, low power, multifunctional and multi band devices. All the above demands will be fulfilled by the development of highly efficient, small-size, low-profile antennas like micro strip and dielectric resonant antennas (DRAs) in wireless domain. The dielectric resonant antennas are highly preferred when compare to other antennas because of its negligible metallic losses at higher frequencies. In this paper i analyze how to increase impedance bandwidth in Hemispherical DRAs especially for Wi-Fi applications and i compare HDRA characteristics for different layers and with rectangular DRA.
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