动力包的循环载荷和疲劳

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765815

T. Hauck

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引用次数: 0

摘要

作者研究了大功率封装在反复大电流负载下的性能。功率晶体管的自热会在有源器件附近引起巨大的温升。由此产生的温度梯度和材料的热失配会导致动力包中的机械应变和应力。在某些情况下，应力水平可能超过模具上金属化层的屈服极限。重复的电流峰值将导致疲劳现象，从而导致设备故障。

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Cyclic loading and fatigue in power packages

The author studied the behavior of power packages exposed to repeatedly high current loads. Self-heating of the power transistors can cause a tremendous temperature rise in the vicinity of the active device. The resulting temperature gradient and the thermal mismatch of materials induce mechanical strains and stresses in the power package. The stress level can in some cases exceed the yield limit of the metallization layer on the die. Repetitive current peaks will then cause a fatigue phenomenon that can cause a device failure.

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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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