印刷电路板测量中多线TRL和2x直通去嵌入实现方法的比较评价

Tugçe Ayraç, Anıl Özdemirli, Emre Apaydin, Kemal Ozanoglu, M. Yazgi
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引用次数: 0

摘要

这项工作提出了两种不同的去嵌入技术的全面研究:多线方法和2X-Thru夹具去除。从校准标准要求、去嵌入方法、夹具移除精度和去嵌入结果等方面对两种方法进行了比较。对比表明,多线法的精度严格依赖于标定标准之间的阻抗变化。另一方面,具有阻抗校正的2X-Thru更容易出现阻抗变化,因为它依赖于单一校准标准,这也简化了测量程序并降低了复杂性。本研究的一个重要目的是促进开源去嵌入工具的发展,因为商业工具的有效性和准确性无法用于学术目的进行评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative Evaluation of Multiline TRL and 2X-Thru De-Embedding Implementation Methods on Printed Circuit Board Measurements
This work presents a comprehensive study of two different de-embedding techniques: the Multiline method and the 2X-Thru fixture removal. The methods are compared in terms of calibration standard requirements, de-embedding methodology, fixture removing accuracy, and de-embedding results. The comparison reveals that the accuracy of the Multiline method strictly depends on the impedance variation between calibration standards. The 2X-Thru with impedance correction, on the other hand, is more prone to impedance variation since it relies on a single calibration standard, which also eases the measurement routine and reduces the complexity. One important aim of this study is to contribute to the development of open-source de-embedding tools since the validity and accuracy of commercial tools cannot be evaluated for academic purposes.
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