低辐射剂量辐照NMOS晶体管的氧化物和Si/SiO/sub 2/界面的电学特性

B. Djezzar, A. Amrouche, A. Smatti, M. Kachouane
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引用次数: 5

摘要

首先用/sup 60/Co γ射线源对不同尺寸的n沟道MOSFET进行几种总剂量(低剂量)照射,然后用标准电荷泵浦(CP)和扩展到低频的标准电荷泵浦技术对其栅极氧化物SiO/ SiO/sub 2/和界面Si/SiO/sub 2/进行表征。两种技术都揭示了两种由低辐射总剂量引起的辐射诱导氧化电荷陷阱形成机制。最初,在氧化层中有一个正电荷的积累,随后由于产生负电荷或/和正氧化物陷阱转变为界面陷阱,净正电荷减少(反转效应)。界面阱随辐射剂量呈线性增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical characterization of oxide and Si/SiO/sub 2/ interface of irradiated NMOS transistors at low radiation doses
N-channel MOSFET's of different dimensions were first irradiated with /sup 60/Co Gamma rays source at several total doses (low doses) and then their gate oxides, SiO/sub 2/ and interfaces, Si/SiO/sub 2/ were characterized by using the standard charge pumping (CP) and the extended standard CP to low frequencies techniques. Both techniques reveal two radiation induced oxide charge traps formation mechanisms, caused by low radiation total doses. Initially, there is a build-up of positive charge in the oxide layer, followed later by diminution of net positive charge (Turn around effect) due to generation of negative charge or/and transformation of positive oxide traps to interface traps. While the interface traps exhibit a linear increase with radiation doses.
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