一种用于高计数率成像系统的40nm CMOS制程像素读出芯片,具有最小的电荷共享效应

P. Maj, P. Grybos, R. Szczygiel, P. Kmon, A. Drozd, Grzegorz Deptuch
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引用次数: 6

摘要

我们提出了一个基于40纳米CMOS工艺的像素检测器读出原型芯片。该原型芯片的像素矩阵为18×24,像素间距为100 μm。它可以在两种模式下工作:单光子计数(SPC)模式和C8P1模式。在采用高增益设置的SPC模式下,测得ENC为84 e- rms(峰值时间为48 ns),增益为79.7 μV/e-,有效失调扩展为24 e- rms。在C8P1模式下,尽管存在电荷共享,但芯片重构了沉积在检测器中的全部电荷,并指向电荷沉积最大的像素。报告了芯片结构和初步测量结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A pixel readout chip in 40 nm CMOS process for high count rate imaging systems with minimization of charge sharing effects
We present a prototype chip built in a 40 nm CMOS process for readout of a pixel detector. The prototype chip has a matrix of 18×24 pixels with a pixel pitch of 100 μm. It can operate in both: the single photon counting (SPC) mode and the C8P1 mode. In the SPC mode using the high gain setting the measured ENC is 84 e- rms (for the peaking time of 48 ns), the gain is 79.7 μV/e-, while the effective offset spread is 24 e- rms. In the C8P1 mode, the chip reconstructs full charge deposited in the detector, despite the charge sharing, and it points to a pixel with the largest charge deposition. The chip architecture and preliminary measurements are reported.
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