CMOS集成电路中总电离剂量效应的物理数值模拟

M. V. Cassani, L. S. Salomone, S. Carbonetto, E. Redin, A. Faigón, M. Garcia-Inza
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引用次数: 0

摘要

提出了一种基于物理的数值模型,作为预测CMOS集成电路总电离剂量响应的仿真工具。该模型包括了由于LOCOS隔离方法导致的标准晶体管栅极氧化物和鸟喙寄生晶体管的辐射诱导电荷积累。模拟了标准mosfet的零偏置辐射响应,显示了n沟道和p沟道晶体管的差异。对于高剂量水平,寄生晶体管中的电荷积累导致nMOSFET的断开状态泄漏电流增加。逆变器的辐射响应作为泄漏电流增量可能对简单CMOS电路造成的后果的一个例子。该模型成功地预测了高吸收剂量下延迟的增加和电路的失效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A physics-based numerical modeling of total ionizing dose effects in CMOS integrated circuits
A physics-based numerical model is proposed as a simulation tool to predict the total ionizing dose response of CMOS integrated circuits. The model includes the radiation-induced charge buildup within both the gate oxide of the standard transistors and the bird’s beak parasitic transistor due to LOCOS isolation method. The zero bias radiation response of standard MOSFETs is simulated, showing the difference between n- and p-channel transistors. For high dose levels, the charge buildup in the parasitic transistor leads to an increase of the off-state leakage current for nMOSFET. The radiation response of an inverter is shown as an example of the consequence this increment of the leakage current may cause to the simple CMOS circuit. The model showed to successfully predict the increment in the delay and the failure of the circuit for high absorbed doses.
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